Patents

一种可测量挤压筒内壁摩擦因数的热挤压模型

Release time:2024-08-09
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Affilication of Author(s):
冶金工程学院
Scope of patent:
国内
Disigner of the Invention:
王一童
Type of Patent:
发明专利
State of Patent:
专利申请
Service Invention or Not:
yes
Application Date:
2018-10-15
First Author:
Eric Wang,wangwei,wangwen,Kuaishe Wang,Jane,gaoyuan