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中文
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Patents
一种装配式框架结构梁柱耗能连接键
Release time:2024-08-09
Hits:
Affilication of Author(s):
土木工程学院
Scope of patent:
国内
Disigner of the Invention:
谢海侨,石安仁,胡高兴,刘鑫怡
Type of Patent:
发明专利
State of Patent:
专利申请
Application Number:
2019107041255
Service Invention or Not:
yes
Application Date:
2019-07-31
First Author:
huangwei
Pre One:
一种基于双盒竖缝连接技术的装配式混凝土模块及系统
Next One:
一种基于T型板的装配式墙体连接结构
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