Effects of the Cooling Rate on the Solidification Microstructure of Cu-Ni Alloy
发布时间:2024-08-09
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- 所属单位:
- 冶金工程学院
- 发表刊物:
- Materials Science Forum
- 关键字:
- 中文关键字:铜镍合金;数值模拟;冷却速度,英文关键字:Cu-Ni alloy; Numerical simulation; Cooling rate; S
- 摘要:
- The effect of cooling rate on the solidification microstructure of Cu-Ni alloy is investigated here. The Cu-Ni alloy was prepared in a main frequency furnace with three different molds made of silica sand, graphite, and low carbon steel in the foundry. The simulation software of diathermanous-flowing-stress coupling PROCAST is used to simulate the Cu-Ni alloy solidification process about temperature field with the three molds. The microstructures of the alloys have been studied through the optical microscopy (OM), the scanning electron microscopy (SEM), together with the energy dispersive spectroscopy (EDS).The results show that the grain average size and the primary and secondary dendrite arm space were obviously reduced with the increase of cooling rate. The dendrite and interdendrite element segregation also decreases with increasing cooling rate.
- 备注:
- 庞玉华
- 合写作者:
- YuhuaPang,YangleiHu,QiSun,Dong
- 第一作者:
- JiaweiYuan,庞玉华
- 论文类型:
- 期刊论文
- 卷号:
- 卷:658
- 期号:
- 期:
- 页面范围:
- 页:444-447
- 是否译文:
- 否
- 发表时间:
- 2010-07-01