庞玉华

教授    硕士生导师

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  • 教师拼音名称: pangyuhua
  • 所在单位: 冶金工程学院
  • 学历: 博士研究生毕业
  • 性别: 女
  • 学位: 工学博士学位
  • 在职信息: 在职

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Effects of the Cooling Rate on the Solidification Microstructure of Cu-Ni Alloy

发布时间:2024-08-09
点击次数:
所属单位:
冶金工程学院
发表刊物:
Materials Science Forum
关键字:
中文关键字:铜镍合金;数值模拟;冷却速度,英文关键字:Cu-Ni alloy; Numerical simulation; Cooling rate; S
摘要:
The effect of cooling rate on the solidification microstructure of Cu-Ni alloy is investigated here. The Cu-Ni alloy was prepared in a main frequency furnace with three different molds made of silica sand, graphite, and low carbon steel in the foundry. The simulation software of diathermanous-flowing-stress coupling PROCAST is used to simulate the Cu-Ni alloy solidification process about temperature field with the three molds. The microstructures of the alloys have been studied through the optical microscopy (OM), the scanning electron microscopy (SEM), together with the energy dispersive spectroscopy (EDS).The results show that the grain average size and the primary and secondary dendrite arm space were obviously reduced with the increase of cooling rate. The dendrite and interdendrite element segregation also decreases with increasing cooling rate.
备注:
庞玉华
合写作者:
YuhuaPang,YangleiHu,QiSun,Dong
第一作者:
JiaweiYuan,庞玉华
论文类型:
期刊论文
卷号:
卷:658
期号:
期:
页面范围:
页:444-447
是否译文:
发表时间:
2010-07-01