Lichen Shi

  • Personal Information
  • Name (English): Lichen Shi
  • Name (Pinyin): shilichen
  • School/Department: 机电工程学院
  • Education Level: PhD student
  • Business Address: 草堂校区机电楼
  • Contact Information: bestslc@xauat.edu.cn
  • Degree: Doctoral degree
  • Professional Title: Professor
  • Status: Employed
  • Alma Mater: 西安建筑科技大学

Paper Publications

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Prediction of surface roughness based on wavelet packet transform-residual network

Release time:2025-02-15
Hits:
DOI number:
10.13196/j.cims.2023.10.003
Journal:
Computer Integrated Manufacturing Systems
Key Words:
surface roughness; vibration signal; wavelet packet transform; residual network; titanium alloy
Abstract:
To improve the prediction accuracy of the model for surface roughness and avoid the dependence of feature extraction and selection on prior theoretical knowledge in traditional machine learning prediction method, a surface roughness prediction method based on Wavelet Packet Transform (WPT) and Residual Network (ResNet) was proposed. In this method, the vibration signal was decomposed into wavelet packet coefficients of different frequency bands by using wavelet packet transform, and the coefficient matrix was formed by fusing the wavelet packet coefficients of each frequency band for capturing the relationship between adjacent frequency bands. The input of ResNet was obtained by superposing the coefficient matrices of different directions of centerless lathe, and the features with strong ability to characterize surface roughness were adaptively extracted by ResNet. The prediction of surface roughness was realized. Compared with other prediction methods, the prediction results of the proposed method were close to the actual measurement results, and the accuracy was improved, which proved that the proposed method was more effective.
First Author:
wanghaitao,YANG Peidong
Indexed by:
Journal paper
Correspondence Author:
Lichen Shi
Discipline:
Engineering
Document Type:
J
Volume:
29
Issue:
10
Page Number:
3249-3257
Translation or Not:
no
Date of Publication:
2023-01-01
Included Journals:
EI