Patents

空间网格结构的通用装配式节点

Release time:2024-08-09
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Affilication of Author(s):
土木工程学院
Scope of patent:
国内
Disigner of the Invention:
魏建鹏
Type of Patent:
发明专利
State of Patent:
专利授权
Application Number:
2016103988619
Service Invention or Not:
yes
Application Date:
2016-06-07
Authorization Date:
2017-12-19
First Author:
haojiping,tianlimin