Patents

一种基于多层堆叠PCB的LVDT传感器

Release time:2025-01-02
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Affilication of Author(s):
机电工程学院
Scope of patent:
国内
Disigner of the Invention:
李蓓,吴莹子,徐凯,张宸
Type of Patent:
发明专利
State of Patent:
专利申请
Service Invention or Not:
yes
Application Date:
2024-12-27
First Author:
wanghaitao