一种基于多层堆叠PCB的LVDT传感器
Release time:2025-01-02
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- Affilication of Author(s):
- 机电工程学院
- Scope of patent:
- 国内
- Disigner of the Invention:
- 李蓓,吴莹子,徐凯,张宸
- Type of Patent:
- 发明专利
- State of Patent:
- 专利申请
- Service Invention or Not:
- yes
- Application Date:
- 2024-12-27
- First Author:
- wanghaitao
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