一种CuCo双金属有机框架复合硫材料及其制备和用途
Release time:2024-08-09 
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                    - Affilication of Author(s):
 - 机电工程学院
 
- Scope of patent:
 - 国内
 
- Disigner of the Invention:
 - 韩国栋,李永鹏,杜振强,张晶,姚佳,张咪,李勇
 
- Type of Patent:
 - 发明专利
 
- State of Patent:
 - 专利授权
 
- Application Number:
 - 201811216964.4
 
- Service Invention or Not:
 - yes
 
- Application Date:
 - 2018-10-18
 
- Authorization Date:
 - 2021-08-24
 
- First Author:
 - wangjuan
 
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