一种CuCo双金属有机框架复合硫材料及其制备和用途
Release time:2024-08-09
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- Affilication of Author(s):
- 机电工程学院
- Scope of patent:
- 国内
- Disigner of the Invention:
- 韩国栋,李永鹏,杜振强,张晶,姚佳,张咪,李勇
- Type of Patent:
- 发明专利
- State of Patent:
- 专利授权
- Application Number:
- 201811216964.4
- Service Invention or Not:
- yes
- Application Date:
- 2018-10-18
- Authorization Date:
- 2021-08-24
- First Author:
- wangjuan
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