一种半导体制冷板
Release time:2024-08-09
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- Affilication of Author(s):
- 建筑设备科学与工程学院
- Scope of patent:
- 国内
- Disigner of the Invention:
- 曹嘉璇,吴松恒,王超杰
- Type of Patent:
- Utility models
- State of Patent:
- 专利授权
- Application Number:
- 201921347617.5
- Service Invention or Not:
- yes
- Application Date:
- 2019-08-19
- Authorization Date:
- 2020-05-19
- First Author:
- wangyi
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