Patents

一种半导体制冷板

Release time:2024-08-09
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Affilication of Author(s):
建筑设备科学与工程学院
Scope of patent:
国内
Disigner of the Invention:
曹嘉璇,吴松恒,王超杰
Type of Patent:
Utility models
State of Patent:
专利授权
Application Number:
201921347617.5
Service Invention or Not:
yes
Application Date:
2019-08-19
Authorization Date:
2020-05-19
First Author:
wangyi